SMTA International 2025（SMTAi）將于美國時間10月19日至23日在美國伊利諾伊州羅斯蒙特舉辦“國際電子制造與SMT技術封裝大會”。銦泰公司中國區(qū)技術經理胡彥杰和銦泰公司研發(fā)部助理經理白進進將代表銦泰中國出席本次大會，并發(fā)表兩場重要技術演講。分享我們在系統(tǒng)級封裝與焊接技術方面的最新研究成果。

PRESENTATION DETAILS

演講主題：

Application of New Ultra-Low Residue Solder Paste for System-in-Package

演講時間：

Wednesday October 22, 2025 2:30pm – 3:00pm CDT

演講摘要：
In the context of system-in-package (SiP) assembly, solder paste printing is widely regarded as the preferred method of solder application. Given the necessity for compatibility with subsequent underfill and molding processes, the predominant selection involves water-soluble solder paste in conjunction with a flux-cleaning operation. To streamline the assembly process and minimize costs, the adoption of ultra-low residue (ULR) solder paste, in combination with ULR flip-chip flux, presents a viable alternative. This thesis presents the development and application of a novel solder paste, designated as F-1, which comprises of flux F-1 combined with Sn96.5Ag3.0Cu0.5 (SAC305) Type 6 (T6) fine solder powder. The primary advantage of utilizing this solder paste lies in its generation of minimal and entirelybenign flux residues, which are anticipated to be compatible with molding underfill (MUF) or capillary underfill (CUF) materials, thereby obviating the need for a flux cleaning process during packaging. Furthermore, assessments of solderability, slump behavior, and printing performance provide compelling evidence that solder paste F-1 is a suitable material for high-density SiP assembly processes.

INDUSTRY EXPERT

胡彥杰

資深技術專家，銦泰公司中國區(qū)技術經理，深耕半導體封裝領域20年，專注于先進封裝技術開發(fā)與工藝優(yōu)化，對電子組裝及封裝材料應用有著深刻的理解和豐富的實踐經驗。曾為眾多行業(yè)頭部客戶提供技術支持，助力技術升級，并積累大量成功案例。

現任銦泰公司中國區(qū)技術負責人，統(tǒng)籌全國技術團隊為半導體封裝及電子制造客戶提供全流程技術和產品支持。曾在CSTIC、IMAPS、CSPT、PCIM、SMTA等國內外論壇以及學術會議上發(fā)表多篇技術文章，擔任中國SMTA技術顧問委員會委員、審稿人。擁有中科院計算技術研究所集成電路工程碩士及南開大學理學學士學位。

PRESENTATION DETAILS

演講主題：

A Novel Flux-Less Solder Paste Reflowed Under Formic Acid for Surface Mounting Technology

演講時間：

Wednesday October 22, 2025 2:00pm-2:30pm CDT

演講摘要：
Solder paste is utilized as the main soldering material in the applications of Surface mounting technology (SMT). Approximately 50% flux by volume in the traditional solder paste leads to more or less post reflow flux residues which has risks of electro migration and conformal coating compatibility directly impact the potential for early device failures. Flux-less soldering which means residue free soldering with gaseous activation such as formic acid has been investigated for decades, most studies are well established in the field of preform or solder bump soldering. And flux-less solder paste is being evaluated by semiconductor markets. This passage explored the potential for the flux-less solder paste in SMT application. A novel flux less solder paste with Sn96.5Ag3.0Cu0.5 (SAC305) and a specially-designed binder was developed and tested according SMT process. The performance testing included printability, wetting, voids, residue content, SIR. These tests were conducted and compared with regular no-clean solder paste for SMT application.

INDUSTRY EXPERT

白進進

白進進，銦泰公司研發(fā)部助理經理，專注于先進半導體和電子組裝材料的開發(fā)及應用。

她在半導體和電子組裝先進材料方面擁有十余年的開發(fā)經驗。主導開發(fā)了在減少錫珠方面性能優(yōu)異的新型焊錫膏材料；并打破細粉焊錫膏如五號粉必須在氮氣氣氛下回流的瓶頸，成功研制了可以應用于空氣回流的五號粉焊錫膏。目前，她正致力于半導體芯片粘接新材料的開發(fā)。

產品推薦

在傳統(tǒng)的焊接工藝中，傳統(tǒng)錫膏依靠助焊劑來清除焊接層界面的氧化物，以確保焊料的潤濕性。在大多數情況下，尤其是在功率電子封裝中，回流后的殘留物必須進行清洗以確保器件可靠性。甲酸作為一種高效環(huán)保的無助焊劑替代方案，在回流焊接過程中展現優(yōu)異的工藝特性。我們的FAST錫膏為此而設計，助焊劑被一種由溶劑和觸變劑組成的復合物所取代，不僅提供了優(yōu)異的操作性能，同時消除了回流后清洗的步驟。

FAST錫膏技術優(yōu)勢：

無需清洗：FAST錫膏中的創(chuàng)新復合粘結劑在回流過程中完全蒸發(fā)，幾乎不留任何殘留物，且無需清洗。

簡化流程：省去回流后的清洗步驟意味降本增效；工藝步驟的減少，也意味著降低了工藝風險。

兼容性：采用FAST錫膏焊接的元件表面干凈無殘留；可直接進行引線鍵合、封裝或灌封等后續(xù)工序。

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隨著電子產品的不斷升級和新應用的涌現，電子制造技術正面臨著前所未有的挑戰(zhàn)和機遇。銦泰公司通過持續(xù)的技術創(chuàng)新，為行業(yè)發(fā)展注入新的動力，助力客戶在激烈的市場競爭中保持領先地位。

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